| 摘要 |
PURPOSE:To obtain stable method for connecting a semiconductor integrated circuit having protruding electrodes with a circuit board, by attaching a large amount of adhesive agent to the protruding electrodes arranged on the periphery, out of protruding electrodes of the semiconductor integrated circuit, as compared with the residual protruding electrodes, and bonding the protruding electrodes, to which the large amount of adhesive agent is attached, to the circuit board. CONSTITUTION:A large amount of adhesive agent 2 is made to attach to protruding electrodes 4 arranged on the periphery, out of protruding electrodes 4 of a semiconductor integrated circuit 3 having protruding electrodes, as compared with the residual protruding electrodes. The protruding electrodes 4 to which the adhesive agent 2 is attached is bonded to a circuit board 5 with which the protruding electrodes are to be connected. For example, after an adhesive agent supplying jig 1 having grooves of two-stage depths l1, l2 as shown in figure is used and conductive adhesive agent 2 is buried in the groove, the surface is flatten with a squeegee or the like. After the protruding electrodes 4 of the semiconductor integrated circuit 3 are aligned on the adhesive agent supplying jig 1, the electrodes are dipped, pressed and pulled up. Then the semiconductor integrated circuit 3 is aligned on the wiring pattern 6 of the circuit board 5 and connected with it. |
