| 摘要 |
PURPOSE:To mount an electronic component by a connection with high reliability by adhering the component on a printed board with anaerobic conductive paste, covering it with a film, vacuum-packing the whole, and curing the paste at a low temperature. CONSTITUTION:Wirings 7 on a printed board 6 are coated with anaerobic conductive paste 8, an electronic component 9 is placed thereon, and the whole mounting board is vacuum-packed with a vacuum-packing film 10. Uniform pressure is applied to the whole component 9, and the paste 8 is started to be cured. Thus, the component 9 can be connected with very high reliability without depending upon its shape. The size, mixing amount of filler particles of the paste 8 are varied to provide anisotropic conductive paste, and the component is finely connected. |
