| 摘要 |
PURPOSE:To make the surface of a spare solder layer flat by a method wherein a plate-like member to which solder does not adhere is placed on a board while the board is made to pass through a heating oven. CONSTITUTION:After a solder cream is applied onto a foot print 2 provided onto a printed board 1, a plate-like member 11 is installed on the solder cream 3 concerned. The plate-like member 11 is formed of Ti to which solder does not adhere, and the printed board 1 is made to pass through an infrared heating over 7 as the plate-like member 11 is placed on the board 1. By this setup, as the solder cream 3 is molten, the surface of the molten solder can be easily made flat with a very low pressure, and a spare solder layer is formed on the printed board without an additional process in which a pressure is given by a press after the molten solder cream is solidified. |
