PHENOLIC-MODIFIED EPOXY ADHESIVE

摘要

Viscous oligomeric epoxy resins can be quickly cured at temperatures of 100 DEG C. by incorporating a hardener that is a blend of (a) the oligomeric reaction product of bisphenol A and bisphenol A monoglycidyl ether and (b) an imidazole. The cured resins are tough and resistant to both moisture and high temperatures. Prepregs, in which glass, graphite or polymeric organic fiber sheets are saturated with these resins, are particularly useful in the repair of damaged aircraft and aerospace structures.