MOUNTING STRUCTURE FOR SEMICONDUCTOR DEVICE, MOUNTING SUBSTRATE AND SEMICONDUCTOR DEVICE

摘要

PURPOSE:To prevent a semiconductor device from being protruded from a mounting substrate and prevent the quality deterioration due to soldering by storing the semiconductor device in the recess of the mounting board, and connecting both of them with elastic contacts and leads. CONSTITUTION:A storage hole 4 is provided on a mounting board 2, end a semiconductor device 10 is placed in it without partially being protruded from the mounting substrate 2. A required number of contacts 5 are arranged on the inner wall of the storage hole 4 and connected to electric wirings 6 via coupling projections 5a. External leads 17 are made of an elastic member and brought into contact with contacts 5 and electrically connected by the elasticity generated by the external force. No solder is used for external leads, thus the quality deterioration due to heat can be prevented.