发明名称 MULTILAYER PRINTED CIRCUIT BOARD FOR MICROSCOPIC CONDUCTOR AND PLATING METHOD OF THE SAME
摘要 <p>PURPOSE: To attain an adhering force or a stripping force on a plate surface without requiring any copper foil by employing a multilayer laminate comprising a glass cloth impregnated with resin applied onto an inner layer, a polyvinyl fluoride foil applied thereon and an intermediate thin plate applied on the foil. CONSTITUTION: A polyvinyl fluoride foil 4 is employed to obtain a prepreg 2 having a smooth surface in micro scale surely in combination with an intermediate thin plate 5 of a press packet. The polyvinyl fluoride foil also serves as a separating agent between the prepreg 2 and the thin plate 5 and can remove a pressed multilayer surely from a press tool. In order to machine a multilayer printed circuit board furthermore, a hole for receiving a structural member terminal pin or a through hole is made before plating and then pretreated together with the outer surface to grow a crystal thus plating the printed circuit board. According to the method, the outer layer (copper foil) can be eliminated and the manufacturing cost can be reduced.</p>
申请公布号 JPH0348494(A) 申请公布日期 1991.03.01
申请号 JP19900108970 申请日期 1990.04.26
申请人 SCHERING AG 发明人 RUUTOBUITSUHI ARUTENDORUFU
分类号 H05K3/24;H05K3/46 主分类号 H05K3/24
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