| 发明名称 |
HYBRIDSCHALTUNG UND VERFAHREN ZUM HERSTELLEN EINER SOLCHEN SCHALTUNG. |
| 摘要 |
Hybrid circuit and its method of production, in which the electrical connections between the various components (1, 2) are made underneath the substrate (3) on which they are located, with conducting wires (8) which are electrically insulated from one another. Application to microelectronics. <IMAGE> |
| 申请公布号 |
DE3677139(D1) |
申请公布日期 |
1991.02.28 |
| 申请号 |
DE19863677139 |
申请日期 |
1986.10.14 |
| 申请人 |
THOMSON-CSF, PUTEAUX, FR |
发明人 |
DUBOIS, MICHEL, F-75008 PARIS, FR |
| 分类号 |
H01L23/538;H01L25/16;(IPC1-7):H01L25/16;H01L23/52 |
主分类号 |
H01L23/538 |
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