| 摘要 |
<p>PURPOSE:To make an extended wafer holder thin by a method wherein an extending frame is pressed against the upside of a table to make an extended wafer sheet adhere to the underside of the table through an adhesive layer, and the wafer is held as it is extended. CONSTITUTION:A wafer sheet 6 is clamped by clampers 4, and a table 21 is pushed up in the direction of an arrow Z1 as heated. Therefore, the wafer sheet 6 is not only heated but also radially extended, so that wafers are extended as shown by a sign 7a. Then, an extending frame 23 is fitted into a protrusion 21a from above to be positioned on the table 21 and pressed against it as shown by an arrow of Z2. Therefore, an underside 23a of the extending frame 23 is bonded to the wafer sheet 6 through the intermediary of an adhesive layer 6a softened by the heat of the table 21. By this setup, an extended wafer holder can be made thin.</p> |
