HEAT TREATMENT OF SEMICONDUCTOR WAFER,申请号JP19890180362-传众专利搜索

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法人/股东/高管

发明名称	HEAT TREATMENT OF SEMICONDUCTOR WAFER
摘要
申请公布号	JPH0346223(A)	申请公布日期	1991.02.27
申请号	JP19890180362	申请日期	1989.07.14
申请人	HITACHI LTD	发明人	HIRASAWA SHIGEKI;WATANABE TOMOJI;TAKAGAKI TETSUYA;MIYAGUCHI TAKASHI
分类号	H01L21/22	主分类号	H01L21/22
代理机构		代理人
主权项
地址

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