发明名称 Process for the production of a solder coating on metallized materials
摘要 A solder coating is applied to a metallized ceramic part in that at least two layers, in each case composed of nickel, copper, silver, zinc or tin, are applied chemically or galvanically. Under the soldering conditions molten solder metal forms on these layers. Useful layers for hard solders are those which are in each case composed of Ni, Cu or Ag. For example, a layer of nickel, copper or silver, with a layer thickness of at least 0.5 mu m, can be first applied to the metallized ceramic part, followed by at least one further layer of nickel, copper or silver with a layer thickness of 10-105 mu m, until a total layer thickness of 15-300 mu m is obtained.
申请公布号 US4996111(A) 申请公布日期 1991.02.26
申请号 US19900464021 申请日期 1990.01.12
申请人 HOECHST CERAMTEC AKTIENGESELLSCHAFT 发明人 DO-THOI, THA;POPP, KLAUS
分类号 B23K1/20;B23K35/20;C04B37/02;C04B41/90;H05K1/03;H05K3/24;H05K3/38 主分类号 B23K1/20
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