| 摘要 |
<p>PURPOSE:To improve the transmitting characteristic of signals by classifying signal wirings into the wires for high-speed transmission and other wires, arranging the wires required for the high-speed transmission on thin film wiring layers, and arranging the wirings for transmission at not so high speed on thick film wiring layers. CONSTITUTION:Thick film wiring layers wherein alumina ceramic material is used as an insulating material and tungsten is used as a conducting material are laminated in a thick film substrate 17. Thin film wiring layers using copper as a conducting material are laminated in a thin film substrate 18. Of the output signals from an integrated circuit chip 1, the signal which passes through only the thin film substrate 18 is inputted into a thin film signal wiring 6 through a lead wiring 13, an inspecting pad 3 and thin-film signal through hole 5. Of the output signal from the integrated circuit chip 1, the signal which passes through the thick film substrate 17 is inputted into a succeeding pad 11 which is formed on the surface of the thick film substrate 17 by way of the lead wiring 13, the inspecting pad 3, a thin film signal through hole 5 ', and then an exclusive wiring (connecting wiring) 12 for connecting the thick and thin films. The wiring 12 is connected at the lower part of the thin-film signal through hole 5'.</p> |
