LOETVERBINDUNG ZWISCHEN CHIP UND SUBSTRAT UND VERFAHREN ZUR HERSTELLUNG.,申请号DE19863676832-传众专利搜索

发明名称	LOETVERBINDUNG ZWISCHEN CHIP UND SUBSTRAT UND VERFAHREN ZUR HERSTELLUNG.
摘要	Microelectric chips (10) are electrically connected to underlying substrates (14) by means of elongated solder columns (26) made possible by solder dams at the surface of the substrate, the dams being positioned about at least a portion of the connection pads on the surface. Substantial increases in the size of the matrix of such columns are achieved without exceeding applicable shear strain limits, due to the increased deformation of the connectors made possible by their increased length.
申请公布号	DE3676832(D1)	申请公布日期	1991.02.21
申请号	DE19863676832	申请日期	1986.02.07
申请人	INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US	发明人	BLAKESLEE, MARYBELLE C., GOLDEN COLORADO 80401, US;CHANCE, DUDLEY AUGUSTUS, DANBURY, CT. 06810, US;EASTMAN, DEAN ERIC, OSSINING NEW YORK 10562, US;GNIEWEK, JOHN J., TUCSON ARIZONA 85711, US;HO, CHUNG WEN, MONTE SERENO, CA 95030, US;LEVINE, ERNEST N., POUGHKEEPSIE, NY 12603, US;ORDONEZ, JOSE E., PLEASANT VALLEY NEW YORK 12569, US;REILEY, TIMOTHY CLARK, RIDGEFIELD, CT 06877, US;SKARVINKO, EUGENE R., BINGHAMTON NEW YORK 13905, US
分类号	H01L21/60;H01L23/498;H05K1/03;H05K3/34;H05K3/40;(IPC1-7):H01L21/60	主分类号	H01L21/60
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