Inorganic adhesive composition.

摘要

Disclosed is an inorganic adhesive composition comprising (a) an aqueous silica sol and (b) an inorganic refractory powder along with one or more selected from (c) a fine powdery silica, (d) an aqueous alkali silicate solution and (e) a silane coupling agent. After hardened, the hardened product of the composition displays noticeably improved adhesion strength and electric insulating property.