| 摘要 |
PURPOSE:To make possible the stable connection between electrodes at a fine pitch without inflicting damage on circuit boards by a method wherein the bump electrode is connected by pressing to the electrode to correspond to the bump electrode through conductive particles. CONSTITUTION:A bonding agent 22 is selectively applied on a bump electrode 13 of a first circuit board 11, conductive particles 21 are adhered on the bonding agent 12, then, a second circuit board 12 with an electrode formed at a position, where corresponds to the electrode 13 of the board 11, of the board 12 and the board 11 are made to oppose to each other, are pressed to each other and in this state, the bonding agent 22 is hardened and both boards 11 and 12 are fixed. Accordingly, even if irregularity in height is generated in the electrode 13, the particles 21 are deformed at the time of connection and absorb the irregularity. Thereby, the stable connection between the electrodes 13 and 14 at a fine pitch becomes possible without inflicting damage on the boards 11 and 12. |
