发明名称 Coiled spring heat transfer element
摘要 A thermally conductive coiled spring laid on its side provides a compliant, high conductive, low force thermal path between a heat source and a heat sink. Each spring contact provides two parallel heat conduction paths via each coil in the spring. The spring can be canted to permit slidable contact with a surface. In one embodiment a plurality of copper springs arranged in parallel can provide a thermal path between an electronic component and a heat sink in close proximity. The springs may be permanently attached to at least one surface at the points of contact.
申请公布号 US4993482(A) 申请公布日期 1991.02.19
申请号 US19900462688 申请日期 1990.01.09
申请人 MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION 发明人 DOLBEAR, THOMAS P.;NELSON, RICHARD D.;GIBSON, DAVID A.;GUPTA, OMKARNATH R.
分类号 F28F1/12;F28F13/00;H01L23/367 主分类号 F28F1/12
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