发明名称 |
Coiled spring heat transfer element |
摘要 |
A thermally conductive coiled spring laid on its side provides a compliant, high conductive, low force thermal path between a heat source and a heat sink. Each spring contact provides two parallel heat conduction paths via each coil in the spring. The spring can be canted to permit slidable contact with a surface. In one embodiment a plurality of copper springs arranged in parallel can provide a thermal path between an electronic component and a heat sink in close proximity. The springs may be permanently attached to at least one surface at the points of contact.
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申请公布号 |
US4993482(A) |
申请公布日期 |
1991.02.19 |
申请号 |
US19900462688 |
申请日期 |
1990.01.09 |
申请人 |
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION |
发明人 |
DOLBEAR, THOMAS P.;NELSON, RICHARD D.;GIBSON, DAVID A.;GUPTA, OMKARNATH R. |
分类号 |
F28F1/12;F28F13/00;H01L23/367 |
主分类号 |
F28F1/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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