| 摘要 |
PURPOSE:To achieve a low melting point Cu-Ag system alloy solder with excellent wetting property, by including specific amount of Ag, Pd and Si to Cu. CONSTITUTION:The composition of the Cu-Ag system alloy solder is composed of 25-65% Ag, 0.5-25% Pd, 0.25-6.5% Si, and balance is Cu and inevitable impurities. Further, one or >=2 kinds Fe, Ni and Co, one or two kinds 1-10 Sn and In, one or two kinds 1-10 B and Li are added as required. This solder has a low vapor pressure and a low melting point and excellent wetting property is shown in soldering and no base material crack due to the erosion of solder takes place. |
