PROCESS PLATE FOR PLASTIC PIN GRID ARRAY AND METHOD OF MAKING

摘要

2064249 9102388 PCTABS00003 A process plate for the manufacture of molded electronic packages such as plastic pin grid array packages is provided. The process plate is a single fixture which is used to position terminal pins (24), align the pins (24) for electrical interconnection and form the base of the mold during encapsulation. In one embodiment, the process plate comprises a support plate (50) which is used for all standard terminal pin (24) configurations and a thin cover plate (60) which is specific for each terminal pin (24) configuration. The process plate reduces the number of fixtures required to mold an electronic package reducing both cost and assembly error.