| 摘要 |
1,125,428. Semi-conductor devices. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 25 April, 1967 [28 April 1966], No. 19035/67. Heading H1K. In a method of manufacturing a semiconductor device moulded in an envelope of synthetic insulating material, the leads comprise parallel strips having connecting bars which form part of the wall of the mould cavity, the leads being subsequently separated by removing at least part of each connecting bar. As shown, Fig. 3, the leads 3, 5, 7 are manufactured in the form of a comb from a strip of sheet metal and have bars 31, 33 connecting them together near their free ends, to which a transistor die (not shown) is connected. The two parts of the mould are provided with a slot within which the leads and connecting bars lie while the transistor is encapsulated. The assembly is then removed from the mould, the centre part of each bar 31, 33 is removed and the leads are separated from the back of the comb. The use of connecting bars co-operating with a slot in the mould is said to prevent the liquid encapsulant from seeping from the mould between the leads. The projections (35) on the leads left by the removal of the centre part of each bar form stops to limit the depth to which the conductors can be inserted into perforations in a circuit board. The comb may comprise a plurality of sets of leads and adjacent sets may be connected together by a bar 37 so that a plurality of devices can be simultaneously encapsulated in a multiple mould. |
