| 摘要 |
PURPOSE:To obtain a die bonding device, which prevents foreign substances from adhering on a collet and can bond semiconductor chips without generating a crack in a multitude of the semiconductor chips, by a method wherein a film with a plurality of holes formed in it is intermittingly sent between the collet and each semiconductor chip and is made to interpose between the collet and the chip in such a way that the holes and the suction holes of the collet coincide with each other. CONSTITUTION:A die bonding device, by which a semiconductor chip 3 is mounted and fixed on a die stage 1, is provided with a mechanism, which sends intermittingly a film 10 with a plurality of holes 10a formed in it between a collet 9, which sucks and transfers the chip 3, fixes it on the stage 1 and has suction holes for suction use, and the chip 3 to be sucked to make the film 10 interpose between the collet 9 and the chip 3 in such a way that the above suction holes and the holes 10a coincide with each other and enables the collet 9 to suck the chip 3 making the film 10 interpose between the collet 9 and the chip 3. For example, the above film 10 is not used repeatedly, a new film 10 sent out from a spool A 11 is guided by a guide bar A 13, is made to pass through under the suction surface of a plane collet 9, is again guided by a guide bar B 14 and the use finished film 10 is wound up by a spool B 12. |
