TRANSFER OF WAFER

摘要

PURPOSE:To inhibit the generation of particles from a carrier without modifying the structure of the carrier and to make it possible to use the carrier over a long period of time by a method wherein a synthetic resin film for protecting a supporting groove is formed on the periphery of a wafer to house the wafer in the carrier and after the wafer is transferred by the carrier, the film on the periphery of the water is removed. CONSTITUTION:Before a wafer 1 is transferred by a carrier provided with a supporting groove for supporting the end edge part of the wafer 1, a synthetic resin film 9 for protecting the above supporting groove is formed on the periphery of the wafer 1 to house the wafer in the carrier and after the wafer is transferred by the carrier, the film 9 on the periphery of the wafer 1 is removed. For example, before a wafer 1 is housed in a carrier, it is transferred to a position, where both surfaces of the peripheral edge part of the wafer are abutted on coating pieces 8 in a coating recessed part 7 of a coating device 4, a rotating shaft 6 is rotated, a Teflon solution which is fed from the device 4 to the pieces 8 is applied on both surfaces of the peripheral edge part of the wafer 1 and a film 9 is formed. The wafer 1 subsequent to transfer is transferred to a position, where both surfaces of the peripheral edge part of the wafer are abutted on cutting blades 10 of a peeling device 5, the shaft 6 is rotated and the film 9 is shaved off by the blades 10 in such a way as to peel off.