发明名称 |
Anisotropic deposition of silicon dioxide. |
摘要 |
<p>In a radio-frequency plasma deposition reactor (10), SiO2 is deposited from a source (16) of tetraethoxysilane (TEOS). The deposition is made to be anisotropic, that is, to be deposited preferentially on horizontal surfaces, by use in the deposition atmosphere of a constituency such as NH3 or NF3 which inhibits SiO2 deposition, along with a radio-frequency power in excess of 100 watts, which preferentially removes the inhibiting gas from horizontal surfaces through ion impact.</p> |
申请公布号 |
EP0411795(A1) |
申请公布日期 |
1991.02.06 |
申请号 |
EP19900307969 |
申请日期 |
1990.07.20 |
申请人 |
AMERICAN TELEPHONE AND TELEGRAPH COMPANY |
发明人 |
LORY, EARL R.;OLMER, LEONARD J. |
分类号 |
C23C16/40;H01L21/316;H01L21/768 |
主分类号 |
C23C16/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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