发明名称 Anisotropic deposition of silicon dioxide.
摘要 <p>In a radio-frequency plasma deposition reactor (10), SiO2 is deposited from a source (16) of tetraethoxysilane (TEOS). The deposition is made to be anisotropic, that is, to be deposited preferentially on horizontal surfaces, by use in the deposition atmosphere of a constituency such as NH3 or NF3 which inhibits SiO2 deposition, along with a radio-frequency power in excess of 100 watts, which preferentially removes the inhibiting gas from horizontal surfaces through ion impact.</p>
申请公布号 EP0411795(A1) 申请公布日期 1991.02.06
申请号 EP19900307969 申请日期 1990.07.20
申请人 AMERICAN TELEPHONE AND TELEGRAPH COMPANY 发明人 LORY, EARL R.;OLMER, LEONARD J.
分类号 C23C16/40;H01L21/316;H01L21/768 主分类号 C23C16/40
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