| 摘要 |
PURPOSE:To realize an increase in capacity and to reduce a wiring space by a method wherein the other end parts of the conductor leads of the common electrode of respective laminated memory LSI chips are connected to the conductor wirings of a printed wiring board and the other end parts of the conductor leads connected to uncommon electrodes are connected to conductor wirings different from the others at every lamination level. CONSTITUTION:One end parts 12a, 12'a of conductor leads 12, 12' are connected to the electrodes 10, 10' of memory LSI chips 6, 6' through metal projections 11, 11' and one end parts 15a, 15'a of conductor leads 15, 15' are connected to separate electrodes 13, 13' through metal projections 14, 14'. Since the electrodes 10, 10' are the common electrode of the LSI chips 6, 6', the other end part 12b of the conductor lead 12 is superposed on the other end part 12'b of the conductor lead 12' to be connected to the conductor wiring 16 of the printed wiring board 2. However, since the electrodes 13, 13' are the uncommon electrodes of the LSI chips 6, 6', the conductor leads 15, 15' are led out to different positions and the other end parts 15b, 15'b thereof are connected to the different conductor wirings 17, 18 of the wiring board 2 and not brought to a mutual contact state. |
