| 摘要 |
PURPOSE:To increase an effective area for mounting electronic components and to strengthen joining and integration of a metal ring for sealing by connecting and disposing a part of a welled area in vertical groove parts provided separately from each other on the whole periphery of an end face of the main body of a wiring board. CONSTITUTION:Necessary ceramic sheets are laminated. At the time of pressure molding, a mold machined beforehand so as to form vertical grooves 2a' separately from each other in the peripheral end face of the main body 1 of a board is employed for molding, and a baking treatment is applied. After the pressure molding or the baking treatment, in another way, these grooves 2a' are formed by cutting or the like. Thereafter a metallize processing is applied to said peripheral surface to form and provide a necessary weld area 2' and thus a desired ceramic multilayered wiring board is obtained. When a metal ring 4 for sealing is joined and fitted on said weld area 2', an effective are for mounting electronic components on the board is enlarged and also a shield effect is improved when the sealing is made. |
