发明名称 FORMATION OF OPENING IN INTERLAYER INSULATING FILM
摘要 PURPOSE:To restrain photomasks of use from increasing in number, to attain cost reduction, and to securely form an opening by a method wherein laminated insulating layers are successively subjected to a proximity exposure process in which a print gap for each insulating layer is so set as to be gradually smaller as the insulating layers are located closer to the top. CONSTITUTION:First of all, a first insulating layer 3 is applied by the use of a spinner onto a wiring board on which a first metal wiring 2 has been formed. Then, a positive type photosensitive first photoresist 5 is applied through a spinner. Ultraviolet rays hnu for instance, are made to irradiate the first photoresist 5 through the intermediary of a photomask at a print gap of Y1. A part of the first photoresist 5 exposed to ultraviolet rays and the first insulating layer 3 are removed, and then a positive type photosensitive second photoresist 6 is applied by the use of a spinner. Using the photomask 7 which has been used in a first proximity exposure process, ultraviolet rays hnu made to irradiate the second photoresist 6 at a prescribed print gap of Y2. At this point, the print gap Y2 is set smaller than the print gap Y1.
申请公布号 JPH0322587(A) 申请公布日期 1991.01.30
申请号 JP19890157160 申请日期 1989.06.20
申请人 TOSHIBA CORP 发明人 SHIMADA OSAMU;MIYAGI TAKESHI
分类号 H05K3/46 主分类号 H05K3/46
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