STRUCTURE FOR AND METHOD OF COOLING INTEGRATED CIRCUIT DEVICE,申请号JP19890155898-传众专利搜索

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发明名称	STRUCTURE FOR AND METHOD OF COOLING INTEGRATED CIRCUIT DEVICE
摘要
申请公布号	JPH0322596(A)	申请公布日期	1991.01.30
申请号	JP19890155898	申请日期	1989.06.20
申请人	FUJITSU LTD	发明人	NAKADA MITSUHIKO
分类号	H05K7/20;H01L23/467;H01L23/473	主分类号	H05K7/20
代理机构		代理人
主权项
地址

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