Semiconductor package having leads that break-away from supports

摘要

A semiconductor package (10) wherein a semiconductor die (12) is disposed in packaging material (34) and electrically coupled to leads (26) having portions (32) extending from the packaging material (34). The portions (32) of the leads (26) that extend from the packaging material (34) are adhered to the outside of the packaging material (34) and release therefrom when subjected to a predetermined amount of thermal stress. The invention disclosed herein allows consistent alignment of flexible leads (26) while adequately reducing stress caused by the differing coefficients of thermal expansion of the semiconductor package (10) and a printed circuit or the like on which the package is mounted.