APPARATUS AND METHOD FOR TESTING PRINTED CIRCUIT BOARDS

摘要

APPARATUS AND METHOD FOR TESTING PRINTED CIRCUIT BOARDS Apparatus and method for electrical testing of a printed circuit (PC) board having a circuit layout wherein circuit paths interconnect selected platedthrough holes and components are mounted on the board by insertion of component leads through predetermined plated through holes in the board. The test apparatus includes a test board having a circuit layout identical to the circuit layout of the PC board. The test board does not have components mounted on it, but has instead test probes extending through predetermined plated through holes on the test board. The test probes are soldered to the circuit paths on the test board establishing electrical connections between predetermined test probes via circuit paths on the test board. To test the PC board, test probes are brought into contact with component leads on the PC board and since electrical interconnections already exist between certain test probes, electrical interconnections between components on the PC board are established via the test probes and circuit paths on the test board allowing electrical testing of the PC board before the component leads are soldered to the PC board.