FILM FOR MACHINING WAFERS

摘要

PCT No. PCT/JP85/00284 Sec. 371 Date Jan. 16, 1986 Sec. 102(e) Date Jan. 16, 1986 PCT Filed May 23, 1985 PCT Pub. No. WO85/05734 PCT Pub. Date Dec. 19, 1985.This invention provides a wafer processing film comprising a base film having a Shore D hardness of 40 or less and an adhesive layer disposed on one surface of the base film. In grinding the surfaces of wafers such as silicon and similar wafers, breakage can be prevented by affixing the wafers to the adhesive layer of the processing film and then grinding them.