| 摘要 |
PURPOSE:To make it possible to prevent a wire left on balls connected to the upper parts of the electrodes of an IC chip from coming into contact with other balls by a method wherein the moving direction of a bonding tool at the time of cutting of the balls from the wire is properly changed according to the positions of the electrodes of the IC chip. CONSTITUTION:In case balls are respectively connected to the upper parts of electrodes of an IC chip 5 using a ball bonding method, the balls are cut from a wire and the balls only are respectively connected to the upper parts of the electrodes to form bumps, the motion of a bonding tool during the cutting process of the wire from the balls is properly changed in every electrode of the chip 5 in the above cutting process of the balls from the wire, the form of the wire on the balls is preset and the wire is prevented from coming into contact with the electrodes adjacent to the wire. For example, in case bumps are formed on electrodes on A and C sides 10 and 12 of an IC chip 5, a bonding tool is moved relatively to a direction (x) to perform a cutting of a wire and in case bumps are formed on electrodes on B and D sides 11 and 13 of the chip 5, the bonding tool is moved relatively to a direction (y) to perform a cutting of the wire. |
