发明名称 |
SEMICONDUCTOR DEVICE AND PREPARATION THERE OF AND BONDING WIRE USED THERE OF |
摘要 |
A resin encapsulated semiconductor device comprises a semiconductor element (3), a conductive terminal (4) and a wire (1) connecting the element (3) and the terminal (4). A thermosetting resin (12) encapsulates the component hermetically to protect the device from a mechanical stress and ambient atmosphere. In order to achieve good bonding of the wire (1) at its ends, the wire (1) is made of a metal (e.g. Al) having in the annealed state a maximum elongation at room temperature of not more than 60%, the wire having been annealed before the bonding. |
申请公布号 |
KR910000154(B1) |
申请公布日期 |
1991.01.21 |
申请号 |
KR19830000939 |
申请日期 |
1983.03.08 |
申请人 |
HITACHI LTD. |
发明人 |
ONUKI JIN;SUWA MASADERU;KOIZMI MASAHIRO;IZKA TOMIO;TAMAMURA TAKEO |
分类号 |
B23K20/00;H01L21/48;H01L21/60;H01L21/607;H01L23/31;H01L23/49;H01L23/495 |
主分类号 |
B23K20/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|