| 摘要 |
PURPOSE:To sharply reduce a man-hour and a time required for production of a sample by a method wherein after the one surface of a semiconductor device is secured on the flat surface of a rotary type sample holder, the other surface is brought into contact with the polishing surface of a rotary table. CONSTITUTION:The one surface of a semiconductor device 1 is secured on the flat surface of a rotary type sample holder 3 by using a double-coated tape. The other surface of the semiconductor device 1 secured to the holder 3 is brought into contact with a rotary type polishing table 4, and with this state, the two members are rotated in the directions of arrow marks reverse to each other to apply a polishing work on the other surface of the semiconductor device 1. |
