发明名称 Method of making a hermetically sealed package having an electronic component.
摘要 Forming a body (10) of insulating material with a shelf (14) and an opening (12) therethrough with a plurality of electrical conductors (16) extending from the shelf (14) to the exterior of the body. A plurality of tape automated bonding leads (26) are placed in the opening (12) in which the inner ends of the leads are connected together. The outer ends (28) of the leads are aligned with the electrical conductors (16) and bonded thereto and the inner ends (30) of the leads are disconnected from each other. An electronic component (50) is bonded to a bottom cover (52), aligned in the opening (12), and the inner ends (30) of the leads are bonded to the electrical component (50). The bottom (52) and a top cover (60) are sealably connected to the body (10) enclosing the opening and the electronic component.
申请公布号 EP0407649(A1) 申请公布日期 1991.01.16
申请号 EP19890112993 申请日期 1989.07.14
申请人 MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION 发明人 ANDREWS, DANIEL MARSHALL
分类号 H01L21/50 主分类号 H01L21/50
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