| 摘要 |
PURPOSE:To improve heat sink by forming a first conductive layer in a partly exposed structure, and directly mounting a semiconductor chip of a high heat generating component on the first layer. CONSTITUTION:A first insulating layer 12 is formed on a metal board 11, first conductive layers 34, 34 are formed on the layer 12, a second insulating layer 22 is formed on the layers 24, 34, and a second conductive layer 13 is formed on the layer 22. The layers 24, 34 are formed in a partly exposed structure. Thus, a semiconductor chip of a high heat generating component can be directly mounted on the first conductive layer to improve heat sink. |
