Multilayer wiring substrate

摘要

A module substrate which mounts a plurality of electronic parts on the surface thereof and in which the voltage is uniformalized at power source feeding pads connected to the electronic parts. Pins for receiving an external power source are formed on the back surface of the module substrate. The module substrate includes a spreading conductor layer to which the power source is connected via pins and which is spread over the whole module, a plurality of uniformalizing conductor layers are connected to the feeding pads on the surface of the substrate via the through-holes and that are provided independently for each of the electronic parts. A plurality of resistance means have ends on one side connected to the plurality of uniformalizing conductor layers, and have ends on the other side connected to the spreading conductor layer. The resistance means have resistances determined in advance depending upon the power consumption of the electronic parts corresponding to the uniformalizing conductor layers.