| 摘要 |
PURPOSE:To enable attaching to be performed at high speed and without foam by carrying out a tack for slightly attaching one part of a film, after that, conducting main compression bonding in pressing the wide surface or whole surface of the film. CONSTITUTION:When a strip-shaped lead frame 20 wherein a plurality of lead frames line thereon is supplied, the lead frame 20 is positioned and installed by the installing mechanism of a tacking unit 12, and while punching out a film with an adhesive agent delivered therein into a predetermined shape per every piece by a punching mechanism, a tacking work is performed by a pressing mechanism. In the next place, the lead frame 20 is held at a predetermined temperature and for a predetermined time keeping the sticking condition by a baking treatment unit 14, and then baking treatment is given thereto. Following this, the lead frame 20 is positioned and installed by a main compression bonding mechanism 16, and then main compression bonding is carried out for compression-bonding it in pressing the approximately-whole surface of the film for a predetermined time, at a predetermined temperature and in a predetermined pressure by a heating mechanism and pressing mechanism. |
