| 摘要 |
PURPOSE:To allow the cracking to intricate shapes by momentarily opening a hole in a work to generate a crack around the same, deciding this crack as a start point for processing and developing the crack along the processing line by the thermal stress generated by heating with a laser beam. CONSTITUTION:The laser beam 3 is focused at the high energy density to the work 1 consisting of a brittle material to instantaneously bore the hole 4. The crack 5 is generated around the hole 4 and is decided as the start point A for processing. The crack is developed along the processing line 2 by the thermal stress generated by heating the part near the processing line 2 using the laser beam 3 as the heat source. The entire part of the work is cooled to improve the rate of developing the crack. The entire stage for cracking the brittle material on the processing table is executed in this way. |
