| 摘要 |
PURPOSE:To make possible a bonding of wires from both surfaces of a semiconductor device and to make it possible to arrange pads at free positions on the device by a method wherein a through groove to penetrate a substrate is provided in each pad and a conductive material is put in the groove. CONSTITUTION:Pads 102 are formed by a method wherein information is stored in a mask, holes are bored in a semiconductor substrate 101 by photoetching at the time of the formation of a semiconductor device and wires 106 are bonded on both surfaces of each pad from both surfaces of the device. That is, a through groove is provided in each pad 102 and a conductive material 103 is put in the groove, whereby it becomes possible to bond wires 106 on both surfaces of a semiconductor device from both surfaces of the pad 102. Thereby, it becomes possible to arrange the pads not only on the periphery of the semiconductor device but also at free positions on the device and a freedom in pad arrangement is significantly improved. |
