| 摘要 |
PURPOSE:To reduce the two-dimensional spread to miniaturize a microwave circuit by using respective planes of plural laminated substrates to arrange circuit parts and constituting the circuit three-dimensionally. CONSTITUTION:First and second insulating or half-insulating substrates 21 and 25 are laminated a gap (t) apart from each other. An input-stage low-noise amplifying part 22, a mixer part 23, and an IF amplifying part 24 are formed on the surface of the first substrate 21, and an image signal eliminating filter consisting of a coplanar terminal open line is provided on the surface of the second substrate 25. Earth elecrodes of two substrates are connected with a conductor between them, and desired signal transmission lines are connected with a conductor between them. Thus, two-dimensional spread is reduced to miniaturize the microwave circuit as the whole. |
