RESIN LACK PART DETECTING METHOD IN RESIN-CONTAINED SOLDER WIRE,申请号JP19890130210-传众专利搜索

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发明名称	RESIN LACK PART DETECTING METHOD IN RESIN-CONTAINED SOLDER WIRE
摘要
申请公布号	JPH02310266(A)	申请公布日期	1990.12.26
申请号	JP19890130210	申请日期	1989.05.25
申请人	NIPPON ARUMITSUTO KK	发明人	KAWAGUCHI TORANOSUKE
分类号	G01B11/10;B23K35/40;B65H63/036;G01B21/12	主分类号	G01B11/10
代理机构		代理人
主权项
地址

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