| 摘要 |
<p>A phenolic resin-extended polycarboxylic acid resin formed by heating together, at 400-500 deg.F., for at least 30 mins. (1) 50-95 parts by wt. of a siccative polycarboxylic acid resin, having an acid no. of at least 30 and (2) 50-5 parts by wt. of an oil-sol., non-heat reactive phenol aldehyde. As a film-forming coating material or as a binder resin for particulate solids in a coating process wherein an electrically conductive object is coated by the electrically induced deposition of a polycarboxylic acid resin from an aq. bath.</p> |
