发明名称 EPOXY RESIN MULTILAYER COPPER COATED LAMINATED BOARD
摘要 PURPOSE:To improve adhesion strength of epoxy resin and a copper foil by using epoxy resin having three or more epoxy radicals in one molecule and by attaching a silane coupling agent to an oxidized surface of an inner layer copper foil. CONSTITUTION:Silane coupling agent is attached to a rough side of copper foil. A mixture of epoxy resin which includes epoxy resin having three or more epoxy radicals in one molecular at least 10wt.% and a prepreg are laminated between two sheets of copper foil. The lamination is heated, pressurized, and cured to acquire a lamination whose both sides are coated with copper. Then, after specified pattern etching is applied, it is immersed in black oxidation treatment solution to carry out oxidation treatment to a lustrous side of the copper foil. Furthermore, after the lamination is immersed in water solution of silane coupling agent, the prepreg and the copper foil are laminated up and down. Thereafter, heating, pressurizing and curing are carried out to acquire a four-layer copper coated laminated board. Thereby, it is possible to improve adhesion of epoxy rein and a copper foil and to improve reliability of a fine pattern such as a high density printed substrate.
申请公布号 JPH02308595(A) 申请公布日期 1990.12.21
申请号 JP19890129809 申请日期 1989.05.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUTAKUCHI MICHIO;OKABASHI KAZUO;NAKAJIMA HIROYUKI;TAKAHAMA TAKASHI
分类号 H05K3/46 主分类号 H05K3/46
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