| 摘要 |
PURPOSE:To provide the title composition excellent in the heat resistance, cracking resistance, humidity resistance, etc., of a molding by mixing a specified ether imide compound with a specified maleimide compound, and a reaction product of an epoxy resin with an acrylic acid. CONSTITUTION:An imide resin composition is produced by mixing an ether imide compound of formula I (wherein R1 to R4 are each H, a lower alkyl, a lower alkoxy, chlorine or bromine; R5 and R6 are each H, methyl, ethyl, trifluoromethyl or trichloromethyl; and D is an ethylenically unsaturated dicarboxylic acid residue), a maleimide compound of formula II [wherein X is -O-, -CH2-, -C(CH3)2-, -C(CF3)2- or formula III], and a reaction product of an epoxy resin with an acrylic acid. By sealing an electronic device with the obtained imide resin composition, the reliability of the sealed electronic device can be improved. |
