| 摘要 |
PURPOSE:To increase mechanical strength and heat dissipation, and obtain a small-sized package having electromagnetic shielding effect which is easily manufactured, by sealing a metal cap for a semiconductor chip arranged on a metal substrate via high melting point glass, and necessary leads by using low melting point glass. CONSTITUTION:A metal cap 17 seals a semiconductor chip 11 mounted and arranged on high melting point glass 13 on a metal substrate 12 of low thermal expansion alloy. Said cap 17 is seal-bonded together with the following by using low melting point glass 18; inner leads 15 of Al or Cu thin film connected with bonding wires 16, and outer leads 14 connected with the inner leads 15. By this constitution wherein the seal is performed by using the metal cap and low melting point glass without using a plastic cap, mechanical strength and heat dissipation are increased, and electromagnetic shielding effect is realized. Further a small-sized and low cost semiconductor package is easily manufactured. |
