| 发明名称 |
METHOD FOR TEARING PLATE OF FRAGILE MATERIAL |
| 摘要 |
<p>A method of asymmetrically cleaving a plate (1) of brittle material, in which a thermal load (3) and a mechanical load (21) are provided on the plate (1) and the plate (1) is cleft along a desired cutting line (7).</p> |
| 申请公布号 |
JPH02296745(A) |
申请公布日期 |
1990.12.07 |
| 申请号 |
JP19900116991 |
申请日期 |
1990.05.08 |
| 申请人 |
PHILIPS GLOEILAMPENFAB:NV |
发明人 |
YAKOBUSU NIKORAASU DETSUKAA;MAARUTEN HARUMU ZONNEFUERUTO;HANSU HARENKANPU |
| 分类号 |
B23K26/40;B26F3/06;B28D1/22;C03B33/09 |
主分类号 |
B23K26/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
