发明名称 DEVICE TRANSPLANTING METHOD
摘要 PURPOSE:To allow the repair and exchange of parts, such as passive elements and active elements, by transporting previously produced transplanting devices to the desired place of a sample and executing the electrical or mechanical connection of the devices and the sample by utilizing a focused beam. CONSTITUTION:The previously produced fresh microdevice parts are transported to the desired place on the sample 200 and the electrical or mechanical connection of the sample 200 and the microdevice parts is executed by observing and working means for the sample 200 and the microdevice parts by utilizing the focused beam 1. Namely, the fresh parts which are previously produced separately to the parts to be repaired or exchanged in the microdevice products degraded in function by a fault or a secular change, etc., are transplanted in place of the above-mentioned parts. The repair and exchange of all the parts are executed in this way regardless of whether the parts are the active elements or passive elements.
申请公布号 JPH02294644(A) 申请公布日期 1990.12.05
申请号 JP19890114941 申请日期 1989.05.10
申请人 HITACHI LTD 发明人 ONISHI TAKESHI;KAWANAMI YOSHIMI;MADOKORO YUICHI;UMEMURA KAORU;ISHITANI TORU
分类号 B23K15/00;B23K26/00;B23P21/00;G03F1/72;G03F1/74;H01J37/317;H01L21/00;H01L21/302;H01L21/82;H01L25/04;H01L25/16;H01L25/18;H01L27/01;H01L41/09;H05K13/04 主分类号 B23K15/00
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