发明名称 FORMATION OF CERAMIC ELECTRONIC COMPONENT ELECTRODE
摘要 PURPOSE:To prevent the development of cracks and the penetration of glass component and simplify manufacturing processes by depositing metallic resinates on the surface or both end parts of a ceramic element assembly and, in addition to performing baking treatment of its element assembly, forming it as an active film. CONSTITUTION:Metallic resinates such as Pd, Au, Pt, Rh and the like which have heat-resisting properties that are free from deterioration caused by high temperature are deposited at both end parts where external electrodes of each ceramic laminated substance are formed. After that, an organic solvent is made to scatter and at the same time, the metallic resinates are formed as active films by applying baking treatment to a green ceramic laminated substance at a temp. as 1300-1400 deg.C. When plating treatment is performed for the sintered ceramic laminated substance with electric plating or electroless plating, a plating film which forms the external electrodes at both end parts of the ceramic laminated substance is formed only at parts of the active films formed by the metallic resinates. A yieldin1g rate is thus improved without developing cracks and also lowering the junction strength of the electrodes as well.
申请公布号 JPH02294007(A) 申请公布日期 1990.12.05
申请号 JP19890114754 申请日期 1989.05.08
申请人 TDK CORP 发明人 IWATANI SHOICHI;OGASAWARA TADASHI;MARUNO TETSUJI
分类号 H01G4/12;H01G13/00 主分类号 H01G4/12
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