| 摘要 |
PURPOSE:To reduce power supply noise in a semiconductor chip for prevention of erroneous operation by providing a bypass capacitor between first and second power supply potentials supplied to the semiconductor chip in a semiconductor device. CONSTITUTION:There is provided on the upper surface of a semiconductor die 6 a first bonding pad 7 for introducing a first power supply potential into the semiconductor die 6 through a first lead frame 2 and a first wiring lead 9. There is also provided a second bonding pad 8 for introducing a second power supply potential into the semiconductor die 6 through a second lead frame 3 and a second wiring lead 10. The first and second die pads 1, 5 form a relatively large capacity condenser through a dielectric film 4 inserted therebetween. That is, a bypass capacitor is provided between the first and second power supply potentials. Herein, the power supply potential in a semiconductor chip is stabilized, and hence erroneous operation of the semiconductor device due to power supply noise in the semiconductor chip is prevented.
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