发明名称 PATTERN FORMING METHOD
摘要 PURPOSE:To eliminate the abnormal biting of a pattern section independently of substratum material, and generalize the adaptability of resist material, by making the substratum material or a silicon oxide film dense. CONSTITUTION:On a substrate, a film composed of substratum material is treated by CVD method or vacuum deposition method, or formed by spreading method. The film is heat-treated at a high temperature, thereby obtaining a dense state. Thereon a film composed of chemical amplification system resist containing compound which generates acid turning to catalyst by radiant ray irradiation is formed. After energy beam of a desired pattern is projected, a pattern is formed by development. Thereby catalyst in the resist can be prevented from moving into the substratum material, the abnormal biting phenomena of a pattern section is dissolved, and the adaptability of resist material is generalized.
申请公布号 JPH02290012(A) 申请公布日期 1990.11.29
申请号 JP19890330979 申请日期 1989.12.22
申请人 HITACHI LTD 发明人 SUGA OSAMU;OKAZAKI SHINJI;SUZUKI MASAYASU;ITO CHIKAICHI
分类号 G03F7/095;G03F7/26;H01L21/027;H01L21/30 主分类号 G03F7/095
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