| 摘要 |
<p>PURPOSE:To obtain a mold type device of high mounting reliability by arranging, on a top force, an orifice plate which faces the header main surface side and does not come into contact with the header main surface, and injecting resin toward the orifice plate. CONSTITUTION:A lead 5 of a lead frame is pinched by molds 23, 24. A height defining segment 19 stretching from a header 1 is retained outstanding pieces 28, 29 protruding from the molds 23, 24, and the interval between the bottom surface of a cavity 25 and the rear of the header 1 is kept at a specified value. In the cavity 25 between a pair of arms 18 of the header, a columnar body 30 is arranged on the mold 23, and turned into a screw hole 4 after molding. In the cavity 25, an orifice plate 32 protruding from the mold 23 is provided, and a iris 31 is formed. On both sides of the cavity 25, the plate 32 is not formed but a rib 12 is formed by resin injection. When resin is injected from a gate 26 toward the orifice plate 32, the flow is directed between the lower surface of the header and the main surface of a bottom force, and a part which is not filled with resin does not generate, and an excellent package is obtained.</p> |
