| 摘要 |
<p>PURPOSE:To prevent violent contact pressure from being applied to a pin tip, and desirably connect the pin tip with an electrode pad, by applying over drive from a contact position. CONSTITUTION:Each pin tip arranged on the lower surface of a probe card is fixed so as to be in parallel with the top surface 12 of a mounting stand 11. The mounting stand on which a wafer is mounted is made to ascend by an exclusive switch, until each pin tip comes into contact with the wafer. In this operation, the pin contact is confirmed by using a microscope, an edge sensor, a TV camera, etc. After that, the over drive amount inputted from the outside is made to ascend by the exclusive switch.</p> |
